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Important Dates (GMT +8:00)

  1. Abstract Deadline: 20 April 2016
  2. Full Paper Deadline: 1 March 2016
  3. Acceptance Notification: 20 April 2016
  4. Camera-ready Paper Deadline: 1 May 2016
  5. Early Bird Deadline: 22 March 2016

Announcement

CALL FOR PAPERS

 

The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. You are invited to submit paper at The 1st International Conference on Invention & Design 2016 (ICID 2016).

The 1st International Conference on Invention & Design (ICID) 2016
"DRIVING INNOVATION THROUGH INVENTION AND DESIGN”
KUALA LUMPUR CONVENTION CENTRE

13-14 May 2016

 

Official Website: http://www.icid.com.my


 

INTRODUCTION

In recent years, design and invention approaches, which integrate social, business and management needs of all kinds, (in terms of strategies, concepts, ideas, organisation and new strategic partnerships) have increasingly gained importance. The Malaysian Invention & Design Society (MINDS) through the ICID 2016, seeks to encourage and offer an avenue for exchange with regards to the theoretical research and evidence-based practices and proposals taking place in various campuses the world over. Scholarly success stories and emergent ideas on design and invention are greatly encouraged.

Together with Universiti Malaysia Perlis (UniMAP), MINDS hopes that the conference theme “DRIVING INNOVATION THROUGH INVENTION AND DESIGN” will create opportunities for conversation about the complex challenges in bringing about an innovative environment in creative institutions and thrust efforts towards:

a.  fostering greater understanding and insights of the problems being addressed;

b.  greater sharing of the current state-of-the-art (encompassing the multi- and inter-disciplinary aspects of invention and design);

c.  promoting closer collaboration to avoid the pitfalls that comes with rolling out such innovation;

d.  creating avenues for high-level policy review

 

Co-located with the 27th International Technology, Innovation and Invention Exhibition (ITEX 2016), ICID aims to attract more than 300 delegates from more than 30 countries. ICID 2016 invites submissions related to the following sub-themes

1. Sustainability in Science and Technology / Design / Social Sciences / Humanities

2. Creativity in Science and Technology / Design / Social Sciences / Humanities

3. Cultivating Innovation in Science and Technology / Design / Social Sciences / Humanities

4. Protecting Intellectual Property in Science and Technology / Design / Social Sciences / Humanities

 

AREA COVERED

Areas covered include but not limited to the following:

a) Science and Technology

Engineering, Physical Sciences: Mathematics, Physics, Chemistry, Biology and Geosciences, Aerospace Technology, Agricultural, Biotechnology, Health Sciences, Nanotechnology, Electricity / Electronics, Audio-Visual Equipment, Telecommunications, Environmental and Renewable Energy, Computing and Information Technology, Mechanical and Manufacturing, Industrial Design, Machines and Equipment, Automotive and Transportation, Materials, Fabric and Garment, Building and Construction, Product design, Printing and Packaging, Special Care and Child Care, Sports and Games, Marine Sciences, Technologies for Prevention and Mitigation of Natural Disasters, Renewable energy.

b) Design

Design Theory, Design Method and Tool, Design and Emotion, Design Thinking, Design Activity, Universal Design, Inclusive Design, Sustainable Design, Design and Culture, Design and Safety, Social Design, Colour Design, Product and Furniture, Form and Composition, Graphics, Information Design, Interaction Design, Fashion Design, Affective Design, Design Pleasure, Design Science, Design for Product Life Cycle, Product Service Design, Computational Design Synthesis, ECO Design Implementation, Simulation Based Design, Creativity and Innovation, Designer’s Attitudes and Skills, Beyond Design: Future Trends and Scenarios, Digital Revolution and its Influence, Co-Creation and Participatory Design, Corporate Identity and Branding, Retails Design, Design & Well-Being

c) Social Sciences

Anthropology, Archaeology, Psychology, Demography, Economics, Education, Geography, History, Law, Business, Library Science, Linguistics, Management, Philosophy, Political Science, Public Administration, Psychology, Sociology, Criminology, Demography

d) Humanities

Classics, History, Languages, Law, Literature, Performing Arts, Music, Theatre, Dance, Philosophy, Religion, Visual Arts, Performing Arts

 

Registration and Submission

a. Registration and submission of Full Paper must be done electronically VIA the online.

 

b. IMPORTANT!! 3 Submission Format / Template must be strictly followed;

1. Abstract Submission - Download Abstract template in "Download" menu.
2. Full Paper Submission - Download Full Paper template in "Download" menu. Camera Ready format follows the Full Paper Template
3. Copyright Form - Download Copyright Form in the "Download" menu. Upload the Form in the system in :My Submission menu > Copyright.

 

 

 

For Conference Detail click on the following Official Website:

http://www.icid.com.my

 

 

JOINTLY ORGANIZED BY:

 

 

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The International Conference on Advanced Material Engineering & Technology is the premier forum for the presentation of new advances and research results in the fields of Advanced Material Engineering and Technology. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. The ICAMET 2012 will be held in Penang Island, Malaysia.  All accepted papers from ICAMET 2012 will also be published on international journal Advanced Materials Research and will be indexed in EI Compendex, Thomson ISTP and Elsevier SCOPUS databases. Trans Tech Publications will provide online camera-ready paper submission system to save time and decrease the publishing cycle. Selected excellent papers will be published on international reputation journals.

All accepted papers of ICAMET 2012 will be published by Advanced Materials Research Journal, which will be indexed by EI Compendex.