3rd International Recent Trends in Technology, Engineering and Computing Conference (IRTTEC) 2022
Hard Rock Hotel Penang, Penang, Malaysia
29 & 30 August 2022
ALL ACCEPTED, PAID AND PRESENTED PAPERS WILL BE SUBMITTED TO A SCOPUS INDEXED PUBLICATION
KEYNOTE SPEAKER 1
KEYNOTE SPEAKER 2
ABOUT OUR CONFERENCE
The 3rd International Recent Trends in Technology, Engineering and Computing Conference (IRTTEC) 2022 will be held on 29 & 30 August 2022 in Penang, Malaysia. This conference provides lots of networking opportunities to scholars, professors and practitioners for corporate and development sectors. The scope of this conference is broad and covers many aspects of international technology perspectives. This conference aims to provide scholarly platform to participants to share their valuable knowledge and current information with others. The conference is expected to attract the participation of academics, researchers and professional practitioners of 'engineering' and 'computing' not only in Malaysia, but also abroad. Knowledge sharing of ideas among academics and professionals has the potential to bridge the gaps and build an understanding on the various aspects of 'engineering' and 'computing' nationally or internationally. Keynote speakers are specially invited to share their views and ideas on recent issues. This conference is in hybrid mode to give participants option and enhance event flexibility.
HYBRID CONFERENCE MODE
In order to provide participants more flexibility, we offer the option to attend in-person onsite or virtual/online via our dedicated conference virtual platform. For participants who will be joining us onsite, the registration fee is inclusive of Scopus proceedings (researcher/presenter), certificate, 2 tea breaks, 1 lunch, conference kits, mineral water and mints, paper and pencil. For virtual participants, the registration fee is inclusive of Scopus proceedings (researcher/presenter) and e-certificate.
1) ONSITE PRESENTATION
Presenters are required to attend in-person onsite and make 10-15 minutes presentations (including Q & A).
2) VIRTUAL PRESENTATION
Presenters are required to attend in-person online and make 10-15 minutes presentations (including Q & A).
TOPICS
Topics of interest for submission include, but are not limited to:
Global Perspectives
Innovation and Entrepreneurship
Social and Humanitarian Impact
Industry Engagement
Artificial Intelligence
Data Analytics
Cloud Computing
Internet of Things
Robotics
1. Technology
Informational Technology
Manufacturing Technology
New Media Technology.
Ocean Technology
Sensing Technology
Technology for Big Data
Technology for Cloud Computing
Technology for Community
Technology for Digital Age
Technology for Human Use
Technology for Learning
2. Engineering
Acoustical Engineering
Aerospace Engineering
Agricultural Engineering
Biological Systems Engineering
Biomedical Engineering
Bioprocess Engineering
Biotechnology
Chemical Engineering
Civil Engineering
Computer Engineering
Electrical Engineering
Electronic Engineering
Energy Engineering
Environmental Engineering
Food Engineering
Genetic Engineering
Geotechnical Engineering
Industrial Engineering
Information Engineering
Manufacturing Engineering
Marine Engineering
Materials Engineering
Mechanical Engineering
Mechatronics Engineering
Nano Engineering
Naval Engineering
Nuclear Engineering
Ocean Engineering
Optical Engineering
Petroleum Engineering
Power Engineering
Process Engineering
Resource Engineering
Structural Engineering
Systems and Software Engineering
Telecommunications Engineering
Textile Engineering
Thermal Engineering
Transport Engineering
Web Engineering
Vehicle Engineering
3. Computing
Architecture and Systems Design for Internet of Things
Algorithm Design and Analysis
Big Data
Biometrics
Information Systems
Computer Aided Education Tools
Cloud Computing
Cognitive Science
Computational Complexity Theory
Computational Linguistics and Neuroscience
Computer Animation
Computer Security
Computer Systems
Green Computing
Internet of Things
Network Security
Numerical Analysis
Operating Systems
Programming Paradigms
Quantum Computing Theory
Requirements Analysis
Scientific Computing
Sustainable Computing
Database Management Systems
Evolutionary Computation
Expert Systems
Information Theory
Information Science
Information Security
Information Systems
Internet of Things
Logic Programming
Machine Learning Technique
Natural Language Processing
Network Topology
New Media Technology
Mobile Network and Security
Numerical Algorithms
Software Design
Software Development Process
Software Engineering and Testing
Symbolic Mathematics
Ubiquitous Computing
AWARDS
Best Paper Award
Best Oral Presentation Award
Best Virtual Presentation Award
Best Industry Paper Award
Best Cyber Security Breakthrough Paper Award
Best IR4.0 Paper Award
Best IoT Paper Award
Best Constructive Review Award
PAPER PREPARATION:
Please download the Word template for extensive guidelines on formatting your paper. As a summary, please ensure the following:
- The number of pages are between 6-12 pages (including references).
- Paper size is US Letter.
- The paper includes the author name and affiliation (full address including country).
- There are no page numbers, or headers and footers, within the paper.
- The PDF is free of formatting errors (e.g. corrupt equations, missing or low-resolution figures), since conversion from Word to PDF can introduce formatting errors.
- Text is single spaced, not double spaced.
- The PDF file is editable and not password protected.
- All pages are portrait (landscape pages should be rotated).
- Reference lists are checked for accuracy. References can only be linked via Crossref if they are correct and complete.
- Figures are placed within the text, not collected at the end of the document.
- A thorough proofread is conducted to check the standard of English and ensure wording is clear and concise.
PUBLICATION
IRTTEC 2022 proceedings will be published in the American Institute of Physics (AIP) Conference Proceedings (https://aip.scitation.org/apc/info/forthcoming). AIPCP is a peer-reviewed and open access publication from American Institute of Physics (AIP), United States with Web ISSN: 1551-7616 and Print ISSN: 0094-243X. It is indexed in Scopus and Google Scholar.
All accepted, paid and presented papers will be submitted to the publisher. For publication, it will require a final review by the publishers editorial team.
[IRTTEC 2021 publication: -TBA-]
[IRTTEC 2020 publication: https://iopscience.iop.org/issue/1742-6596/1793/1]
Selected papers (with authors' consent) will be asked to make extensions and submitted to one of the following journals for reviews, and (if accepted) subsequently for publications. Authors may require to pay an additional fee (on selected journal):
Special Issue
Journal of Engineering Research and Education (JERE)
REGISTRATION & SUBMISSON
All submissions must be made through the Conference Management System (ConfBay).
Participant/Presenter Registration
- If you have not registered with Confbay before, click on Register. Follow the instructions listed on the screen.
- If you have registered with Confbay before, you may click on Log In.
Online Paper Submission
- After logging in, you will be able to submit your paper through the Online Submission System.
- Click on the My Submission menu. Follow the instructions listed.
- Notification emails will be sent to you as a confirmation of the submission.
The 2nd
International Conference on Technology, Engineering and Sciences (ICTES) 2021 & The 2nd International Conference on Thermal Sciences and
Fluid Flow (ICTSFF) 2021 is organised by MN Smart Solution in collaboration Kolej Universiti
Islam Pahang Sultan Ahmad Shah and Akademia Baru Publishing. It will be held on
3th-4th April 2021 in Langkawi, Malaysia. This conference provides lots of
networking opportunities to scholars, professors and practitioners for
corporate and development sectors. The scope of this conference is broad and
covers many aspects of international technology perspectives. This conference
aims to provide scholarly platform to participants to share their valuable
knowledge and current information with others. This platforms cover all tracks
of technology and engineering filed such as computing, information science,
electrical and electronic, mechanical and mechatronic, civil and environment,
chemistry, computer science and etc.