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Important Dates (GMT +8:00)

  1. Full Paper Deadline: 30 June 2022
  2. Acceptance Notification: 5 July 2022
  3. Camera-ready Paper Deadline: 5 July 2022
  4. Participant Registration Deadline: 5 July 2022
  5. Payment Deadline: 10 July 2022



1st World Engineering, Science and Technology Application Conference

(WESTAC 2022)
16th – 17th July 2022,

Resorts World Hotel, Pulau Langkawi, Malaysia

1st World Engineering, Science and Technology Application Conference

(WESTAC 2022)
16th – 17th July 2022, 

Resorts World Hotel, Pulau Langkawi, Malaysia





Center of Printable Electronics

Universiti of Malaya

Dr. Norhayati Soin received the B. Eng. (Hons) degree in electrical and electronics engineering from the Liverpool Polytechnic, United Kingdom (1991), MSc degree in Microelectronics Engineering from Liverpool John Moores University, United Kingdom (1999), and PhD degree in Electronics and Systems Engineering from National University of Malaysia (2006). She is currently a Professor at the Electrical Engineering Department, University of Malaya, Malaysia. Her current research focuses on reliability of semiconductor devices/integrated circuit and MEMS sensor, and development of flexible and printable electronics devices.

Norhayati Soin leads the VLSI Reliability Research Group and Center of Printable Electronics at University Malaya, a research centre with cutting-edge facilities solely dedicated to the design, development, and fabrication of printed electronics devices for various novel applications. She has been awarded IEEE Senior Member and currently is the past Chair of IEEE Electron Device Society Malaysia Chapter. Her work has been published in more than 150 papers in journals and proceedings locally and internationally. Dr. Norhayati Soin is a regular reviewer for many high-ranked journals (including IEEE Transaction of Electron Devices, IEEE Access and Elsevier Science Journal). She is the principal investigator and co-investigator for various local and international research and industry grants (UM grant, CREST, FRGS, TRGS, Science Fund, British Newton Fund) on different topics ranging from IC reliability to the development of flexible multi-sensors patch for healthcare applications.

Title: Printed Flexible and Stretchable Electronics for Wearable Health Care

The demand for printed, flexible and stretchable electronics is growing fast. The rapid expansion in smart wearable and integrated electronic devices has stimulated demand for advanced smart systems with high performance, micro size, high reliability, mechanical flexibility, and high-temperature stability for application as flexible and stretchable displays, personal health monitoring, human motion capturing, smart textiles, electronic skins, flexible energy source and others. The main requirement for these applications is flexibility and stretchability, as these devices are subject to various mechanical deformations including twisting, bending, folding, and stretching during operation.

The development of printed, flexible and stretchable conductors over the last decade has resulted in commercialization of flexible and stretchable sensors for various applications, circuits, displays, and energy harvesters for next-generation wearables and soft robotics. These systems must be able to conform to the shape of and survive the environment in which they must operate. They are typically fabricated on flexible plastic substrates or are printed/woven into fabrics.

This presentation will cover the development of current printable, flexible and stretchable devices using advanced materials. The research activities at Center of Printable Electronics. Universiti Malaya will also be highlighted.



Associate Professor

Faculty of Engineering and Information Sciences, 

University of Wollongong,

Dubai, UAE


Faculty of Electronic Engineering Technology, UniMAP is pleased to announce that we will be hosting the 1st World Engineering, Science and Technology Application Engineering Conference (WESTAC) on 16th - 17th July 2022 at Resorts World Hotel, Pulau Langkawi, Malaysia with the theme of "Advancing Science and Technology for Humanity".           

The 1st World Engineering, Science and Technology Application Conference (WESTAC) is the inaugural international conference to be organised by the Faculty of Electronic Engineering Technology, UniMAP and University College TATI (UC TATI) as our CO-Organizer. The aim is to provide a platform to professionals, researchers, academicians and industries to share and generate interest in cutting-edge applications, challenges and issues in the area of engineering, science and technology application. The theme of the conference this year has been chosen in view of the current revolution and rapid developments in the field of engineering, science and technology. A special keynote speaker will be invited to share his idea of the current trend in engineering, science and technology toward humanity.

In order to provide participants more flexibility, we offer the option to attend in-person onsite or virtual/online via our dedicated conference virtual platform. 


Potential papers are solicited in but are not limited to the following topics:
•    Fracture Mechanics and Fatigue
•    Machinery Dynamics
•    Concurrent Engineering
•    Finite element analysis
•    Noise and Vibration analysis
•    Analytical and computational modelling
•    Structural mechanics
•    Behaviour and application of advanced materials
•    Impact mechanics and thermodynamics
•    Robotics Structures and Applications
•    Robot sensors and actuators
•    Robot control and Autonomous Vehicles
•    Surface Engineering/Coatings
•    Materials Forming
•    Materials Machining
•    Welding & Joining
•    Laser Processing
•    Powder Metallurgy
•    Severe Plastic Deformation
•    Tribology in Manufacturing Processes
•    Theory and Application of Friction and Wear
•    Casting and solidification
•    Microwave Processing of Materials
•    Waste-to-Energy, Waste Management and Waste Disposal
•    Thermal Engineering Theory and Applications
•    Rapid Prototyping, Manufacturing, and Tooling
•    E-manufacturing, ERP, and Integrated Factory
•    Sequencing, and Scheduling
•    Virtual Manufacturing, and Simulation
•    Operations, and Production Management
•    Precision Engineering, and Concurrent Engineering
•    JIT, Lean, and Agile Manufacturing
•    DSS, ES and AI in Manufacturing
•    Engineering Optimization
•    Intelligent Systems and Approach
•    Motor drives and motion control
•    Analysis and design of electrical machines
•    Generation Systems
•    Maintenance and Operation
•    Distribution System Planning and Reliability
•    Flexible AC Transmission Systems
•    Micro-electromechanical systems (MEMS)
•    Power System & Energy Engineering
•    Power System Protection, Operation and Control
•    Transmission & Distribution System and Apparatus
•    Power System Stability
•    Fuzzy and Neural Control
•    Mechatronics
•    Manufacturing Control Systems and Applications
•    Process Control Systems
•    Robotics and Automation
•    Soft switching converters
•    Hard-switching and soft-switching static converters
•    Multilevel converters
•    Matrix converters
•    Emerging topologies
•    Power Converters Modelling
•    Simulation and Control
•    Power Factor Correctors (PFC)
•    EMI and over-voltage protection
•    Active Filters and Harmonics
•    Power Supplies
•    Algorithms
•    Computer Architecture
•    Data Compression
•    Network Security and Cryptography
•    Mobile Computing
•    Parallel and Distributing Computing
•    High-Performance Computing
•    Autonomic and Trusted Computing
•    Software Engineering and Knowledge Engineering
•    Artificial Intelligence and Machine Learning
•    Knowledge Discovery and Data Mining
•    Virtual Reality and Visualization
•    Biomedical Informatics and Computation
•    Civil and Environmental Engineering
•    Analysis of Semi-rigid Connections
•    Applied Computer Vision for Civil and Environmental Engineering
•    Augmented and Virtual Reality
•    Buckling and Stability
•    Building Design, Construction, and Operation
•    Civil Engineering, Management and Surveying
•    Computer Controlled Site Instrumentation
•    Construction Automation and Robotics
•    Construction Engineering and Management
•    Dam Engineering
•    Disaster Preparedness, Response and Recovery
•    Distributed Computing in Engineering
•    Dynamics and Earthquake Engineering
•    Energy for Building
•    Environment and Energy
•    Environmental Protection
•    Formfinding, Topology and Structural Morphology
•    Foundation Engineering
•    Fracture Mechanics
•    Geographical Information Systems
•    Geotechnical Analysis and Design
•    Ground Vibration
•    Human Computer Interaction and Graphics
•    Infrastructure Life-cycle Management
•    Intelligent Construction Site
•    Lifetime Costs
•    Linear and Non-linear Dynamics
•    Model Verification and Validation
•    Modeling of Concrete Durability
•    Monitoring and Maintenance of Infrastructure
•    Monitoring of Structures & Buildings
•    Numerical Modeling in Geotechnics
•    Offshore Structures
•    Optimization
•    Productivity
•    Project Management and Quality Assessment
•    Roads and Railways
•    Rock Mechanics
•    Sensors Networks/Instrumentation
•    Simulation and Modeling
•    Food / Pharmaceutical engineering and manufacturing
•    Biotechnology / Bioprocess
•    Enzyme technology / Industrial Biochemistry
•    Petrochemical Processing
•    Separation and Purification Processes
•    Related chemical and Biochemical engineering issues
•    Catalytic Materials & Mechanisms
•    Catalysis for Chemical Synthesis
•    Catalysis and Energy
•    Petrochemistry
•    Catalysis in oil and gas
•    Nanocatalysis
•    Material Sciences
•    Electrocatalysis
•    Environmental Catalysis
•    Chemical Kinetics
•    Reaction Engineering
•    Surface and Colloidal Phenomena
•    Enzymes and Biocatalysts
•    Photocatalysis
•    Nanochemistry
•    Polymer Engineering
•    Fluid dynamics & its Phenomena
•    Simulation & Modeling
•    Catalysis for Renewable Sources
•    Organometallics Chemistry
•    Catalysis and Zeolites
•    Industrial Catalysis
•    Catalysis and Pyrolysis
•    Quantum Chemistry


The highlight of this conference is that all peer-reviewed and accepted papers will be published in a Scopus Indexed Proceedings. Selected papers will be published in several potential Scopus Journals*:

•    International Journal of Nanoelectronics and Materials
•    Journal of Advanced Research in Fluid Mechanics and Thermal Sciences   
•    CFD Letters
•    Materials Science Forum (Book Series)
•    Institute of Advanced Engineering and Science

*Selected papers will be asked to make extensions and submitted to one of the following journals for publications. Authors may require to pay an additional fee for selected journal.

Registration and Submission

a. Registration and submission of Full Paper must be done electronically through the online submission system.

b. Submission Template / Format - Strictly follow the template which can be downloaded at "Download Menu"

Organized By:

Faculty of Electronic Engineering Technology (FTKEN)
Universiti Malaysia Perlis (UniMAP)


Persatuan Alumni UniMAPUniversity College TATI

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The International Conference on Advanced Material Engineering & Technology is the premier forum for the presentation of new advances and research results in the fields of Advanced Material Engineering and Technology. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. The ICAMET 2012 will be held in Penang Island, Malaysia.  All accepted papers from ICAMET 2012 will also be published on international journal Advanced Materials Research and will be indexed in EI Compendex, Thomson ISTP and Elsevier SCOPUS databases. Trans Tech Publications will provide online camera-ready paper submission system to save time and decrease the publishing cycle. Selected excellent papers will be published on international reputation journals.

All accepted papers of ICAMET 2012 will be published by Advanced Materials Research Journal, which will be indexed by EI Compendex.