The primary aim of this conference is to establish itself as the premier annual gathering in the dynamic realms of Applied Science and Engineering, Advanced Technology, Applied Mechanics, Fluid Mechanics, and Thermal Sciences. We envision this event as a vibrant nexus for scholars, researchers, and industry practitioners from every corner of the globe, uniting to showcase groundbreaking advancements and innovative research within their fields. Our goal is to create an inspiring environment that not only encourages the sharing of ideas and knowledge but also fosters collaborative discussions that can ignite new possibilities and drive the future of these disciplines. Join us as we embark on a journey of exploration and discovery, pushing the boundaries of what is possible and shaping the next generation of technological breakthroughs.
SUBMISSION STEP (IMPORTANT!!!):
THEMES FOR CONFERENCE
i. Applied Science and Engineering
- Aerospace Engineering
- Agricultural Engineering
- Architectural Engineering
- Bioinformatics
- Biotechnology
- Biomedical Engineering
- Astronomy
- Automotive Engineering
- Chemical Engineering
- Chemistry
- Civil Engineering
- Corrosion Engineering
- Cosmology
- Electrical Engineering
- Electronic Engineering
- Environmental Engineering
- Genetic Engineering
- Systems Engineering
- Geological Engineering
- Data Mining
- Industrial Engineering
- Information Engineering
- Instrumentation and Control Engineering
- Other related areas
ii. Advanced Technology
- Architectural Technology
- Artificial Intelligence
- Information Technology
- Critique of Technology
- Economics of Technology
- Communication Technology
- Industrial Revolution
- Robotics
- Nanotechnology and Smart Materials
- Scientific Method
- Space Exploration
- Space Environment and Aviation Technology
- STEM Fields
- Technocracy
- Technological Convergence
- Technological Evolution
- Technological Innovation
- Technology & Society
- Technology Assessment
- Technology Journalism
- Image Processing
- Technology Lifecycle
- Technology Management
- Technology Transfer
- Theories and Concepts
- Military Technology
- Other related areas
iii. Applied Mechanics
- Biomechanics
- Electromechanics
- The Mechanical Behavior of Advanced Materials
- Nanomechanics
- Plastic Mechanics, Fracture Mechanics and Damage Mechanics
- Theoretical Mechanics and Applied Mechanics
- Structural Mechanics
- Plastic Fracture and Damage Mechanics
- Mechanics of Materials
- Elasticity
- Solid Mechanics
- Fluid Mechanics
- Rheology
- Hydraulics
- Mechanics of Explosion
- Material Modeling
- Force Analysis
- Resistance and Propulsion
- Theoretical and Applied Mechanics
- Applied Materials Engineering
- Composite and Smart Materials
- Fatigue and Fracture
- Analytical mechanics
- Computational mechanics
- Contact mechanics
- Continuum mechanics
- Rock mechanics
- Rotordynamics
- Solid mechanics
- Soil mechanics
- Dynamics and Vibration
- Noise and Vibration
- Wave Propagation
- Stress Analysis
- Structures
- Impact
- Adaptive materials systems, structures and smart materials
- Concrete and ceramic materials
- Tribology
- Cyclic Deformation
- High Strength Alloys
- Ductile and Brittle Fracture
- Numerical Methods and Optimal Design of Structures
- Noise Control
- Geo-Mechanics
- Micro and Nanomechanics
- Other related areas
iv. Fluid Mechanics and Thermal Sciences
- Engineering flows
- Drops and bubbles
- Computational heat transfer
- Biological flows
- Electrohydrodynamics
- Condensation
- Compressible flows
- Geophysical flows
- Heat transfer in combustion and engines
- Magnetohydrodynamics
- Microscale flows
- Heat exchangers
- Multiphase flows
- Particle -laden flows
- Environmental Heat Transfer
- Reactive flows
- Rotating flows Gas turbines
- Superfluids
- Turbulence
- Heat pipes
- Single phase heat transfer
- Boiling and evaporation
- Nanofluids
- Other related areas
PUBLICATION
Please submit a full paper minimum 9 pages for journal publication. All Accepted papers will be published in Scopus indexed journal.
- SCOPUS indexed publication with DOI
FEES & REGISTRATION TYPE
i. Presenter (Physical/Online) with SCOPUS Publication: RM2500 / USD600
ii. Listener with NO Publication (Physical): RM1000 / USD250
All fees include morning tea, buffet lunch and afternoon tea at Holiday Inn Dubai Al Barsha, Dubai, United Arab Emirates. Please email the proof of payment to finance@akademiabaru.com for our record.
REGISTRATION GUIDANCE:
a. Registration for 5th-ICASEAT2025 must be done electronically through the online system.
• Click on the "Registration" menu to create ConfBay Account and proceed for registration by logging in the system.
• Select the suitable conference fee category to complete the registration.
b. Proceed for Payment.
PAYMENT METHOD
i) FPX/Debit/Credit Card
https://toyyibpay.com/Semarak-Ilmu-Conference
OR
ii) Bank transfer or Telegraphic transfer to the following details:
Beneficiary: SEMARAK ILMU SDN BHD
Bank's Name: MAYBANK
Account number: 562263601782
Swift code: MBBEMYKL
Full Address: 7 & 9, Jalan 9/9C, Section 9, 43650 Bangi, Selangor, Malaysia
Benificiary Address: No 22, Jalan Puteri 5A/3, Bandar Puteri Bangi, 43000 Kajang, Selangor, Malaysia
PROGRAM SCHEDULE
ACCOMMODATION:
If you need accommodation, you may contact Holiday Inn Dubai Al Barsha Hotel at 1800 80 1881 / info@hialbarsha.com or go to their website.
CONTACT
Ts. Dr. Wan Mohd. Arif Aziz Japar
Head of Department,
Department of Research & Consultation
Semarak Ilmu Sdn. Bhd.
Email: arifaziz@semarakilmu.com.my
WhatsApp/Call: +60182759099
Follow us at Facebook: Semarak Ilmu Sdn. Bhd.